Hi,
I need help with a recommended footprint for the QFNWB (7x7 mm) package used in the ESP32-S3FH4R2, per esp32-s3_datasheet_en.pdf v1.4. I was previously using the ESP32-S3-WROOM-1_V1.3_Reference_Design Gerbers as a reference, however the ESP32-S3FH4R2 has a different package with a much bigger ground pad. This is concerning because this probably means I can't route vias/traces underneath the chip.
I can't find a reference design that has the ESP32-S3FH4R2, has one been released yet? If not, when is that expected to be available? Thanks.
ESP32-S3FH4R2 footprint (PCB land pattern)
Re: ESP32-S3FH4R2 footprint (PCB land pattern)
Hi Sansveni,
I am sorry that currently, we have no reference design for ESP32-S3FH4R2, and there is no scheduled release plan either in the near future. You may just refer to the existing reference design documents for other ESP32-S3 series chips, like what you are already doing.
If you meet with any technical problem, please leave reply and we will follow up on the issue!
I am sorry that currently, we have no reference design for ESP32-S3FH4R2, and there is no scheduled release plan either in the near future. You may just refer to the existing reference design documents for other ESP32-S3 series chips, like what you are already doing.
If you meet with any technical problem, please leave reply and we will follow up on the issue!
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