What is the ESP32-PICO Product/Modular(?) RF Certification Process?

[p-rimes]

I wonder what the expected certification process is like for using ESP32-PICO in commercial product designs. I've never seen a "SIP" IC like that before, so I don't know if it counts as a "module" or if modular certification (e.g. by Espressif) would even be possible?

So, is the intended use for high volume product (or v. small wearable), and a full RF certification will be required? And correct me if I'm wrong, but for FCC you would need to put a metal shield around the single IC anyway?

As a hypothetical, what about if the IC had a "metal can" packaging instead of the regular IC plastic packaging (as some other MEMS parts do), would it be eligible for certification without an additional shield?

[WiFive]

Metal shield is only required for modular certification, not single product certification. Also there is "limited modular certification" which meets some but not all of the modular requirements like having a shield. If you look through the database or at products on the market, people screw this stuff up all the time and I would not say there is strict compliance. CYW20732S is a similar device. There was an atheros chip that had a metal case like you mentioned. Right now there is no certification (modular or limited modular) for pico. Maybe the design shown here will ship sometime as module with shield: https://blog.hackster.io/introducing-th ... 476238bc07