Espressif Chip-Packing Information
This document summarizes the packing requirements of Espressif’s chip products, including the packing method, packing-material dimensions, standard packing quantity, labels, dry-packing requirements and marking conventions.
V1.6 2021.10.11
乐鑫芯片包装信息
本文档介绍了乐鑫芯片产品的包装要求，包括包装方式、包装尺寸、标准包装数量等信息。
V1.6 2021年10月11日
also for History here attached EN and CN Version
EN
CN
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请至乐鑫官网 https://www.espressif.com/zh-hans/suppo ... -documents 下载最新版本文档。
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best wishes
rudi
