Production issues with ESP32
Posted: Fri Feb 16, 2024 12:59 am
Hi,
I am having a number of ESP32 rotating during reflow soldering. I suspect either the footprint or stencil and wondering if anyone can help with either of the following:
1) Footprint to suit reflow soldering
2) Specs for the stencil (preferred stencil thickness, aperture enlarge or decrease - particularly the EP pad - which I think might me most of the issue)
thanks
I am having a number of ESP32 rotating during reflow soldering. I suspect either the footprint or stencil and wondering if anyone can help with either of the following:
1) Footprint to suit reflow soldering
2) Specs for the stencil (preferred stencil thickness, aperture enlarge or decrease - particularly the EP pad - which I think might me most of the issue)
thanks