Production issues with ESP32

[orbitcoms]

Hi,
I am having a number of ESP32 rotating during reflow soldering. I suspect either the footprint or stencil and wondering if anyone can help with either of the following:
1) Footprint to suit reflow soldering
2) Specs for the stencil (preferred stencil thickness, aperture enlarge or decrease - particularly the EP pad - which I think might me most of the issue)

thanks

[mikemoy]

Did you follow the footprint recommended form the data sheet ?