Hi,
I am having a number of ESP32 rotating during reflow soldering. I suspect either the footprint or stencil and wondering if anyone can help with either of the following:
1) Footprint to suit reflow soldering
2) Specs for the stencil (preferred stencil thickness, aperture enlarge or decrease - particularly the EP pad - which I think might me most of the issue)
thanks
Production issues with ESP32
Re: Production issues with ESP32
Did you follow the footprint recommended form the data sheet ?
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