Maximum reflow temperature for modules ?
Posted: Sat Jan 20, 2024 3:51 pm
Hi,
The ESP32-H2-MINI-1 datasheet includes a reflow profile presented as a graph with a top temperature of 250C. However it is not very explicit on whether this is a recommended temperature for the recommended profile, or the absolute maximum temperature to use for reflow.
Many of the ESP32 chips, and most of the integrated modules on JLCPCB are listed as "Standard Only" parts, so they end up much more expensive to assemble on a board. Apparently when someone reached out to their support they indicated that the datasheet states 250C, which is above their 255+-5C standard for economic assembly, so all the parts were recently moved to the expensive assembly options.
Is 250C really the absolute maximum ? Would 255+-5C not be acceptable for reflowing ? Due to this issue it is much more expensive to use ESP32 modules in projects (at least when using JLCPCB assembly services), so it would be good to clarify whether this is really a hard requirement.
The ESP32-H2-MINI-1 datasheet includes a reflow profile presented as a graph with a top temperature of 250C. However it is not very explicit on whether this is a recommended temperature for the recommended profile, or the absolute maximum temperature to use for reflow.
Many of the ESP32 chips, and most of the integrated modules on JLCPCB are listed as "Standard Only" parts, so they end up much more expensive to assemble on a board. Apparently when someone reached out to their support they indicated that the datasheet states 250C, which is above their 255+-5C standard for economic assembly, so all the parts were recently moved to the expensive assembly options.
Is 250C really the absolute maximum ? Would 255+-5C not be acceptable for reflowing ? Due to this issue it is much more expensive to use ESP32 modules in projects (at least when using JLCPCB assembly services), so it would be good to clarify whether this is really a hard requirement.