ESP32 Forum

Hi,
I have this problem.
I mount the ESP32_C3_WROOM_02 module in a double SMD face board.
This board has to pass through the reflow oven twice and the module must be in the first mounting layer, so it pass twice in the oven.
I saw the datasheet says "Solder the module in a single reflow".
Which can be the real problems to pass through it twice? Are they mechanical problems (bad welding)? Or future operating problems about module?
How can be the solution if I can't solder it once and I don't want manually solder?

Thanks everybody.
Best regard.

I imagine that things (the shield, things inside the module) will fall off if you reflow it upside-down, to be honest... that would be my first concern.